6G, the sixth generation mobile communication standard, is also known as the sixth generation of mobile communication technology. The main facilitation is the development of the Internet of Things. As of November 2019, 6G is still in the development stage. 6G may have 100 times higher transmission capacity than 5G, and network latency may be reduced from milliseconds to microseconds.

Nokia Bell announced that recently, under the guidance of the Ministry of Industry and Information Technology (MIIT), the IMT-2030 (6G) Advancement Group organized a concept prototype test of key 6G technologies, and Nokia Bell successfully completed the test verification of terahertz communication and pass-through integration. The team will start 6G technology trials in 2022 to evaluate and test potential key 6G technologies. As one of the key members of China IMT-2030 (6G) Promotion Group, Nokia Bell has actively participated and promoted key activities such as research, evaluation and validation of 6G key technologies.

During MWC2023, Qualcomm Technologies announced the launch of its second-generation Snapdragon Automotive 5G modem and RF platform. Qualcomm introduces the second-generation Snapdragon automotive 5G platform with support for satellite communications. As Qualcomm Technologies' automotive modem and RF system, it features high-performance processing and up to 200MHz of network capacity to support reliable and low-latency connectivity for a safe, smart and immersive driving experience. Equipped with the latest 5G technology enhancements, owners can enjoy the comfort and convenience of their car, home and office in the same space. Qualcomm introduces second-generation Snapdragon automotive 5G platform with support for satellite communications.

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The "digital divide" will determine the success or failure of businesses. For many companies, turning "data insights" into business value has been an elusive goal; however, the maturation of artificial intelligence (AI) technology will eventually make this possible - companies can distill data information and put it into action.

Recently, China's largest and the world's third largest packaging and testing company Changdian Technology announced that the XDFOI Chiplet process has achieved a breakthrough, and began to gradually enter the stable mass production stage, synchronised with the realization of the international customers 4nm node multi-chip system integration packaging product shipments, the largest package body area of about 1500mm2 system-level packaging.

From the era of traditional chip domination of the industry, the development of AI chips is not smooth sailing, the bubble is flooded, the capital is cold, the scarcity of talent ...... However, in the semiconductor industry as a whole stepped into the downward cycle of the year 2022, the AI chip in turn shouldered the controversy and questioning in the servers, automobiles, and other fields show an increasingly enlarged value effect.

On 6 January 2023, the final list of "Global Top Brands", which is co-sponsored by Asia Data Group, Europe Data Group and TWICE, and co-organised by IDC, was unveiled at the International Consumer Electronics Show (CES), the world's most recognisable, influential and largest consumer electronics industry event.

Ookla shares the global 5G network performance in a report released today after recently publishing a list of the fastest 5G phones in 10 countries and regions around the world. The report shows that the average global 5G network downlink speed in Q3 2022 was 168.27 Mbps, 1% faster than 166.13 Mbps in the same period last year; however, the average uplink speed was 18.71 Mbps, 12% slower than 21.08 Mbps in the same period last year.